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Report: Samsung is ‘actively looking’ for ways to cool the Galaxy S7

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Samsung Galaxy S6

With apps and games demanding increasing levels of performance, it’s important to make sure smartphones stay cool.

Samsung is struggling with heat issues on the much-rumoured Galaxy S7, a new report reveals.

According to a UDN article, the South Korean tech giant is seeking heat pipe suppliers for its next flagship smartphone.

“Samsung intends to use head pipes in the next generation of products,” reads the report, specifically citing the S7 smartphone.

It continues: “Samsung is recently actively looking for a mobile phone heat pipe supplier for research and development specimens.”

The entire fiasco is reminiscent of this year’s Snapdragon 810 fiasco, which saw the Qualcomm chip plagued by allegations of heat issues.

As an apparent result of this, Samsung opted to use its own custom-built chips in lieu of Qualcomm fare.

This isn’t the first time we’ve heard this rumour; a previous report from October 2015 also alleged that Samsung was experiencing heat issues with the Snapdragon 820.

But is there any truth to the rumour?

Speaking at the New York launch of the Snapdragon 820 last month, Qualcomm VP Tim McDonough quashed rumours of heat issues with the new chip.

McDonough described a number of efficiency improvements with the Snapdragon 820 that means we won’t see a repeat of the Snapdragon 810 debacle.

“Heat is the result of wasted power,” the Qualcomm VP explains. “So the Snapdragon 820 is also more efficient and cooler than previous processors.”

According to Qualcomm, the Snapdragon 820’s GPU alone is 40% less power-hungry than its predecessor.

The X12 LTE modem is also purported to be 15% more efficient than the previous iteration.

As a result of these – and other – improvements, the Snapdragon 820 is claimed to use 30% less power than the Snapdragon 810 overall, according to official Qualcomm figures.

Qualcomm Snapdragon

Related: Snapdragon 820 vs Snapdragon 810

We contacted Qualcomm for comment on this particular rumour, and received the response: “Qualcomm does not respond to rumours or speculation.”

We also asked Samsung to shed light on the matter, but have yet to receive a response.

Do you think these rumours are believable? Let us know in the comments.

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chaosdefinesorder

December 3, 2015, 3:19 pm

even if it's not to reduce excessive heat build-up, they could be using heatspreaders to make the heat more evenly distributed so it feels more uniform to the user rather than a specific hot spot?

dima1

December 5, 2015, 1:35 am

How long has it been since 810 came out? Perhaps lazy journalists should stop referring to 810's "allegations of overheating". If they are still allegations now, they are nothing but unsubstantiated rumors.

toboev

December 6, 2015, 6:47 pm

“Samsung intends to use head pipes..."
That's the problem right there; they should be using heat pipes instead.

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