With apps and games demanding increasing levels of performance, it’s important to make sure smartphones stay cool.
Samsung is struggling with heat issues on the much-rumoured Galaxy S7, a new report reveals.
According to a UDN article, the South Korean tech giant is seeking heat pipe suppliers for its next flagship smartphone.
“Samsung intends to use head pipes in the next generation of products,” reads the report, specifically citing the S7 smartphone.
It continues: “
The entire fiasco is reminiscent of this year’s Snapdragon 810 fiasco, which saw the Qualcomm chip plagued by allegations of heat issues.
As an apparent result of this, Samsung opted to use its own custom-built chips in lieu of Qualcomm fare.
This isn’t the first time we’ve heard this rumour; a previous report from October 2015 also alleged that Samsung was experiencing heat issues with the Snapdragon 820.
But is there any truth to the rumour?
Speaking at the New York launch of the Snapdragon 820 last month, Qualcomm VP Tim McDonough quashed rumours of heat issues with the new chip.
McDonough described a number of efficiency improvements with the Snapdragon 820 that means we won’t see a repeat of the Snapdragon 810 debacle.
“Heat is the result of wasted power,” the Qualcomm VP explains. “So the Snapdragon 820 is also more efficient and cooler than previous processors.”
According to Qualcomm, the Snapdragon 820’s GPU alone is 40% less power-hungry than its predecessor.
The X12 LTE modem is also purported to be 15% more efficient than the previous iteration.
As a result of these – and other – improvements, the Snapdragon 820 is claimed to use 30% less power than the Snapdragon 810 overall, according to official Qualcomm figures.
Related: Snapdragon 820 vs Snapdragon 810
We contacted Qualcomm for comment on this particular rumour, and received the response: “Qualcomm does not respond to rumours or speculation.”
We also asked Samsung to shed light on the matter, but have yet to receive a response.
Do you think these rumours are believable? Let us know in the comments.
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