Another report concerning the troubled production of Qualcomm’s Snapdragon 810 CPU has emerged, this time suggesting that Samsung has dropped it from its next flagship phone.
The Samsung Galaxy S6 will be one of the biggest smartphones of 2015, and it appears it won’t be powered by the usual Qualcomm silicon.
Bloomberg today reports that Samsung will turn to its own Exynos chips for the Samsung Galaxy S6. The reason, according to sources, is that the latest Snapdragon chips have been overheating during testing.
According to one analyst, Song Myung Sup, “Samsung may release the next Galaxy S as early as March, and it can’t dare to take the risk to use any of the chips in question for its most important model.”
This would be a major blow for Qualcomm. It may be the world’s biggest mobile chip maker, but it counts Samsung as its second biggest customer.
Related: Qualcomm 2015 roadmap leaks, 14nm Snapdragon 820 outed
Elsewhere, LG announced its G Flex 2 phone at CES 2015, including the fact that it would be powered by the Snapdragon 810. It’s not known if its late January launch will now be delayed, if an alternative chip can be found, or if the phone can run the troublesome Snapdragon 810 without issue.
This is far from the first report of Snapdragon 810 overheating issues. Various reports over the past few months have made this claim, prompting denials from Qualcomm itself. It’s difficult to believe that nothing is wrong at this point, but we’ll know more as the first batch of 2015 Android flagship phones is announced around MWC 2015.
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Editorial independence means being able to give an unbiased verdict about a product or company, with the avoidance of conflicts of interest. To ensure this is possible, every member of the editorial staff follows a clear code of conduct.
Professional conduct
We also expect our journalists to follow clear ethical standards in their work. Our staff members must strive for honesty and accuracy in everything they do. We follow the IPSO Editors’ code of practice to underpin these standards.
