Samsung will reportedly be manufacturing Qualcomm’s new Snapdragon 830 chipset using a 10nm process.
A report from ETNews claims Sammy will be the sole manufacturer for the new high-end smartphone processors.
What’s more, the company is said to be using the chips in half of the forthcoming Galaxy S8 units it produces, with the Exynos 8895 SoC being used in the other half.
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That makes sense considering the Korean firm used a similar approach with this years Galaxy S7. This year’s flagship Samsung smartphone uses the Snapdragon 820 in the US and the Exynos 8890 elsewhere.
The new 10nm process should ensure better overall performance on the new 830 chips, in comparison to the 14nm-based Snapdragon 820 and Exynos 8890 from this year.
ETNews’ report also claims that Samsung and Qualcomm will develop Fan-out Panel Level Package (FoPLP) technology for next year’s Snapdragon and Exynos chipsets.
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By using such technology, printed circuit boards (PCB) are not required for the package substrate, which should bring down production costs and allow for a thinner package with more input and output ports.
This year’s Snapdragon 820 was a welcome return to form after last year’s 810 was plagued by overheating issues.
Google’s newly announced Pixel phone will make use of the new Snapdragon 821, which is said to come with a 10% performance boost over the 820.
At this point, the reports of Samsung producing the 830 are yet to be confirmed, so take today’s news with due caution.
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