Memory now stackable.
It seems like every week chip manufacturers are telling us about breakthroughs that will lead to faster, smaller products which consume less power, but this is more interesting than most.
Ubiquitous IT multinational Samsung has cracked ‘wafer-level-processed-stacked-package’ (WSP) memory mounting. A mouthful this may be but what it means is memory chips can now be placed on top of one another eliminating the need for wires.
Instead the new modules will contain laser cut micron sized holes which connect directly to the next memory module’s holes using a copper filling. The net effect is not only a large reduction in the amount of space required to mount memory chips but also process which enables Samsung to stack up to 4GB of memory onto a single RAM module. Furthermore the elimination of wires substantially improves performance (potentially lifting memory speeds to 1.6Gbps using DDR3) and cuts power requirements.
A final cherry on the top is that this process can be applied to any form of computer memory so it isn’t just PCs and notebooks that are likely to benefit.
Unfortunately – as with anything particularly Sci-Fi – Sammy was unable to say when we would see WSP memory debut, but with our all consuming desire for size double zero hardware it can’t come soon enough.
That said, stacking doesn’t seem so revolutionary… after all, cheap plastic chairs have been doing it for years…