Apple’s next iPhone may borrow a manufacturing trick from the Apple Watch – an all-in-one SiP processor.
With the iPhone 6S probably just three months away, the rumour mill is starting to go into overdrive concerning its specs.
We’ve already heard the suggestions that the iPhone 6S will borrow one major technological trick from the Apple Watch in the form of a Force Touch display. Here’s another one from the China Times.
Apparently, the next iPhone will see Apple switching from a traditional printed circuit board (PCB) to a System in Package (SiP) set-up for its internal components.
This could see the iPhone 6S’s processor, RAM, storage, and sensors bundled into a single compact package and coated in resin.
The benefits are twofold. First up, you free up valuable space within the device, allowing for a slimmer design or (hopefully) a bigger battery. The second benefit is that the resin coating protects the components from things like water damage.
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According to the report, Apple has been extremely pleased with the way its SiP production has gone with the Apple Watch, to the point that it’s green-lighted the process for its next smartphone.
Whether that will entail a complete PCB replacement or a supplementary approach (a combination of SiP and PCB architecture) is open to conjecture it seems.