IDF Fall 2006 Opening Keynote

Paul Otellini kicks off IDF with the usual roundup of Intel innovations.

With 65nm production well underway now, Otellini was keen to point out that Intel has shipped a total of 40 million 65nm chips, and that its main competitor had shipped none – a childish dig yes, but a fact all the same.

With 65nm reducing leakage by up to 5x over 90nm and increasing performance up to 30 per cent, it’s clear that Intel’s latest die shrinkage has brought some major advantages with it. And those advantages are reinforced by the worldwide acclaim that Core 2 Duo has received.

But Intel is already working on the next step – 45nm. Intel is claiming that 45nm will reduce leakage once more by up to 5x and increase performance by up to a further 20 percent over 65nm.

Intel already has FAB D1D in Oregon producing 45nm test wafers, while FAB 32 in Arizona and FAB 28 in Israel are gearing up for 45nm production. The first 45nm processor design is almost complete and will debut in the next generation Nahalem micro-architecture.

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