The next round of flagship smartphones might be too hot to handle, and not in a good way.
That’s because a new report claims that Qualcomm’s upcoming Snapdragon 820 mobile chip is plagued with overheating issues.
A tweet posted by prolific tipster Ricciolo reads: “SD810 and his successor are NOT so different in terms of HEAT ISSUES. You have to wait for the 830 (P. Q3-16) to ‘partially’ solve this.”
The Snapdragon 820 is the 810’s successor, and looks set to launch either later this year or early next year.
Qualcomm has yet to release an official statement regarding the Snapdragon 820, so we’ll hold off on judgement for now.
It’s also worth mentioning that we’ve got no way of verifying Ricciolo’s information and, as such, it could be spurious.
If it is true, however, then that’s seriously bad news for Qualcomm, a company that’s still struggling to deal with the bad publicity generated with the Snapdragon 810.
The Snapdragon 820 was leaked earlier this year, and features new 64-bit ‘Kyro’ processing cores that promise a maximum clock speed of 3GHz.
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Interestingly, Ricciolo’s tweet also points to Qualcomm launching a Snapdragon 830 chip in the third quarter of 2016.
Qualcomm has yet to make any such announcements, but this could be our first clue as to what 2016 has in store in terms of smartphone chips.
Of course, we should take this entire report with a pinch of salt until at least some evidence is provided.
If you want some more tangible smartphone goodness, check out our handset group test video below: