Endless rumours have been spilling out about Apple's next flagship smartphone over the past few weeks, the latest of which seemingly reveals new iPhone 6S design details.
According to – what are claimed to be – leaked iPhone 6S schematics, the much-rumoured handset will sport a profile measuring 7.1mm.
That’s relatively slim for a flagship device, but it’s just a little thicker than its predecessor, the iPhone 6. That makes all the difference in a world of ever-slimming smartphones, however.
The image of the schematics was first obtained by Engadget.jp, which points to unnamed Chinese sources as being responsible for the leak.
Fortunately, this purported thickness increase could mean Apple is planning any number of spec upgrades for the iPhone 6S.
Related: iPhone 6S Plus vs iPhone 6S
The leaked schematic in question...
The most obvious possibility is that Apple is planning to utilise a larger battery for the iPhone 6S, which would help users squeeze more life out of their devices.
There’s also the recent suggestion that Apple is eyeing up a 12-megapixel camera module – up from the current 8-megapixel sensor – for the iPhone 6S.
With a larger sensor in tow, it’s likely Apple would have to boost the thickness of the iPhone 6S to compensate.
Then there’s the claim that Apple hopes to integrate Force Touch technology into the iPhone 6S.
Adding a Force Touch layer to the display would invariably increase the thickness of the smartphone, so it’s worth bearing in mind.
Related: iPhone 6S review
Of course, we won’t know what Apple is really planning until it launches its next smartphone, and we can’t actually verify these leaked schematics anyway.
However, any of these improvements would likely be welcomed in exchange for a negligible thickness increase, we’re sure.
If you want to see how Apple’s smartphones currently fare against competitors, check out our group test video: