The Huawei Ascend D3 will reportedly be unveiled during IFA 2014 next month, as pictures of the handset’s metal body leak online.
Although the Chinese manufacturer has yet to announce plans to launch such a device, the Huawei Ascend D3 has been the subject of multiple rumours in recent weeks. Now, the teased back plates have provided an early glimpse as to what the handset will have to offer.
As well as the customary camera and flash cut outs, a third hole can be seen on the device’s metal rear panel. According to latest leak, this cut out is to make space for an integrated fingerprint sensor.
Despite the teased metal body set to give the phone a premium appearance, with Huawei’s ‘D’ line of devices aimed at a mid-market audience, the D3’s rumoured specs sheet is a half-step behind the market leading likes of the LG G3.
Tipped to boast a 6-inch, 1080p Full HD display, the Huawei Ascend D3 will reportedly benefit from 2GB of RAM and 16GB of internal storage alongside an octa-core HiSilicon Kirin 920 processor. With a 13-megapixel rear-mounted camera reportedly on the cards, the manufacturer is also expected to appease selfie lovers with a 5-megapixel forward-facing snapper.
IFA 2014 officially runs between September 5 and 10, although the Berlin-based tech convention will be preceded by a couple of announcement filled press events on September 3 and 4.
Far from the only smartphone tipped to be debuted during the show, the Huawei Ascend D3 looks set to share the stage with the Samsung Galaxy Note 4 and the Sony Xperia Z3.
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